EPFL: MICRO-331 Microstructure Fabrication Technologies I

Bibliography

• "Fundamentals of Microfabrication and Nanotechnology, Volume II, Manufacturing Techniques for Microfabrication and Nanotechnology", Marc J. Madou, CRC Press
• "Introduction to Microfabrication, Second Edition", Sami Franssila, Wiley

Links

• Thermo-mechanical micro actuator: computation of the radius of curvature
• Thermo-mechanical micro actuator: dynamic response
• Thermal evaporation: materials and parameters
• Sputtering: plasma detailed explanation

References

• “Successful MEMS devices” images are courtesy from Leti, Freescale-NXP and IHS
• Jun Tsutsumi et al., "Cost-Efficient, High-Volume Transmission: Advanced Transmission Design and Architecture of Next Generation RF Modems and Front-Ends", IEEE Microwave Magazine, Volume: 16, Issue: 7, Aug. 2015, Figure 1, http://ieeexplore.ieee.org/document/7153022/ , Reproduced with permission from IEEE
• Marc J. Madou, “Fundamentals of Microfabrication and Nanotechnology, Volume II, Manufacturing Techniques for Microfabrication and Nanotechnology”, CRC Press Taylor & Francis Group, Pages 160 to 167 (8 pages)
• Dabirian A. et al., “Tuning the Optoelectronic Properties of ZnO:Al by Addition of Silica for Light Trapping in High-Efficiency Crystalline Si Solar Cells”, Adv. Mater. Interfaces, 2016, Figures 1 and 3, http://onlinelibrary.wiley.com/doi/10.1002/admi.201500462/abstract, Copyright Wiley-VCH Verlag GmbH & Co. KGaA, Reproduced with permission
• Honer et al., “Integration of sputtered silicon microstructures with pre-fabricated CMOS circuitry”, Sensors and Actuators A: Physical, 2001, Figure 13 and 15, http://www.sciencedirect.com/science/article/pii/S0924424701006124, Reproduced with permission from Elsevier
• Alvaro Artieda et al., “Effect of substrate roughness on c-oriented AlN thin films”, Journal of Applied Physics, 105, 2009, Figure 1, http://aip.scitation.org/doi/full/10.1063/1.3068309, Reproduced with the permission of AIP Publishing.
• Parylene coating diagram, www.comelec.ch, Reproduced with permission of Comelec
• John A. Thornton, “Structure-Zone Models Of Thin Films”, Proc. SPIE 0821, Modeling of Optical Thin Films, 95 (1988), Figure 3, http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=1249097, Reproduced with permission from SPIE
• John A. Thornton, "Influence of apparatus geometry and deposition conditions on the structure and topography of thick sputtered coatings", J. Vac. Sci. Technol. 11, 666 (1974), Figure 4, http://scitation.aip.org/content/avs/journal/jvst/11/4/10.1116/1.1312732, Reproduced with permission from the American Vacuum Society
• Weileun Fang et al., “On the thermal expansion coefficients of thin films”, Sensors and Actuators A: Physical, Volume 84, Issue 3, 1 September 2000, Pages 310–314, Figure 1, http://www.sciencedirect.com/science/article/pii/S0924424700003113, Reproduced with permission from Elsevier
• Vapor pressure chart, http://www.iuvsta-us.org/iuvsta2/index.php?id=643, Reproduced with permission from IUVSTA
• Photoresist contrast, "Exposure of Photoresist", MicroChemicals
• “UV lithography: direct writing and mask writing” images are courtesy from Heidelberg Instruments Mikrotechnik GmbH
• “Ebeam lithography” images are courtesy from Raith Nanofabrication, Vistec and Paul Scherrer Institut
• Ivo Liška, "Coulomb Interactions in Electron Beams in the Vicinity of a Schottky and Cold Field Emission Sources", Doctoral Thesis, BRNO University of Technology, 2009/2010, Figure 1 and 2, https://www.vutbr.cz/www_base/zav_prace_soubor_verejne.php?file_id=25579
• Magnetic lens image, MyScope, Australian Microscopy & Microanalysis Research Facility, http://www.ammrf.org.au/myscope/tem/background/concepts/lenses/poleandcoil.php, No modifications were made, Shared under Creative Commons License, https://creativecommons.org/licenses/by-sa/2.5/au/
• Mark A. McCord, Michael J. Rooks, "SPIE Handbook of Microlithography, Micromachining and Microfabrication, Volume 1: Microlithography ", 1997, SPIE/IET, Figures 2.9, 2.10, 2.11, 2.12, Reproduced by permission of the Institution of Engineering & Technology
• Garcia et al.,"Advanced scanning probe lithography", Nature Nanotechnology 9, 577-587 (2014), Figure 1 and 5, http://www.nature.com/nnano/journal/v9/n8/abs/nnano.2014.157.html, Reproduced with permission from Nature Publishing Group
• Thermal scanning probe lithography images are courtesy from Swisslitho GmbH
• Nanoimprint lithography images are courtesy from NIL Technology
• Michel et al., "Printing meets lithography: Soft approaches to high-resolution patterning", IBM J. RES. & DEV. VOL. 45 NO. 5 SEPTEMBER 2001, Figure 3, http://ieeexplore.ieee.org/document/5389071/, Courtesy of International Business Machines Corporation, © (2001) International Business Machines Corporation
• Delamarche et al., "Transport Mechanisms of Alkanethiols during Microcontact Printing on Gold", The Journal of Physical Chemistry B 102, no. 18 (April 1998): 3324–34, http://pubs.acs.org/doi/abs/10.1021/jp980556x
• Qin et al., "Soft lithography for micro- and nanoscale patterning", Nature Protocols 5, - 491 - 502 (2010), http://www.nature.com/nprot/journal/v5/n3/full/nprot.2009.234.html, Reproduced with permission from Nature Publishing Group
• Vazquez-Mena et al., "Metallic Nanowires by Full Wafer Stencil Lithography", Nano Lett., 2008, 8(11), pp 3675-3682, http://pubs.acs.org/doi/abs/10.1021/nl801778t
• Vazquez-Mena et al., "Analysis of the blurring in stencil lithography", Nanotechnology, Volume 20, Number 41, 2009, http://iopscience.iop.org/article/10.1088/0957-4484/20/41/415303/meta#citations